Data sheet Product GS 3 P
Thermal interface material / Fixing material / Mounting material>Thermal interface material>Mica wafers
TOP 3, 20.5 x 17.5 mm, customer specific versions on request
Features
| for transistor: | TOP 3
|
| material: | muskovit
|
| material thickness: | 0.05 mm
|
| thermal resistance (GS 3): | 0.4 K/W
|
| dielectric strength: | 5 kV
|
| insulation resistance: | 3·1017 Ω·cm
|
Technical Drawing
