Data sheet Product GS 66 P
Thermal interface material / Fixing material / Mounting material>Thermal interface material>Mica wafers
TO 66, 18 x 13,5 mm, customer specific versions on request
Features
for transistor: | TO 66
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material: | muskovit
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material thickness: | 0.05 mm
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thermal resistance (GS 3): | 0.4 K/W
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dielectric strength: | 5 kV
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insulation resistance: | 3·1017 Ω·cm
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