The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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13 - 24 (39)Number:
sk695_.eps
140 x 10 mm
sk696_.eps
159 x 14.8 mm
sk700_.eps
200 x 83 mm
sk699_.eps
300 x 84 mm
kl35f2.jpg
  • universal, massive aluminium clamp mounting for all 35 mm mounting rails
  • suitable for rail material thicknesses from 1 to 2.3 mm according to DIN EN 60 715 (formerly DIN EN 50 022)
  • fast and easy mounting of heatsinks, casings etc. by direct snap up on the mounting rail
  • safe hold due to a stable extruded profile with integrated wire form spring made of stainless steel
  • special lengths (≥40mm), machinings and surfaces upon request
  • * = examples of mounting rail versions suitable for KL 35
la_hb7.jpg
86 x 86 mm, with axial fan,
high performance cooling aggregate

  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_hb8.jpg
164 x 86 mm, with axial fan,
high performance cooling aggregate
  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_hb9.jpg
243 x 86 mm, with axial fan
high performance cooling aggregate
  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_v_hb7.jpg
86 x 86 mm, with axial fan and air flow chamber,
high performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_v_hb8.jpg
164 x 86 mm, with axial fan and air flow chamber,
high performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_v_hb9.jpg
243 x 86 mm, with axial fan and air flow chamber,
high performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_hb1.jpg
129 x 121 mm, with axial fan

  • extremely low losses of air flow as compared to cooling aggregates with extruded aluminium
  • compact dimensions, that means high performance density due to large heat-conducting surfaces
  • maximum heat flow due to brazing or thermal adhesion
  • high performance cooling aggregates are only effective with forced ventilation by means of the fan, but not with free convection
  • other fan types and fan voltages on request
13 - 24 (39)Number:

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