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Thermal interface material

25 - 36 (125)Number:
wlp.tif
  • density: 1.1 g/cm3
silicon-containing thermally conductive paste
wlft404_405_2.tif
non isolations, double-sided adhesive
aos218_247_1_.eps
  • thermal resistance: 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
TO 218, TO 247, 25 x 21 x 1.5 mm, other strengths and versions on request
gs3p_sl_.eps
  • thermal resistance (GS 3): 0.4 K/W
TOP 3, 20.5 x 17.5 mm, customer specific versions on request
kap218o_.eps
  • thermal resistance: 0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)]
for semiconductor-design TO 218, 23 x 18 mm
wfg15.tif
  • very soft thermal conductive foil
  • without any reinforcing layer
  • optimal balance of bigger unevennesses
  • thermal conductive foil both-sided adherent
  • cuts and contours according to customer specific drawing specifications
wfkf30web.jpg
  • density: 1.44 g/cm3
  • thermal resistance: 0.165 K/W
  • thermal conductive foil for silicone-free applications
  • epoxy-based thermal conductive foil
  • excellent insulation properties
  • cut to size and contours according to customised drawing specifications
wlft404_405_2.tif
isolations, double sided adhesive
wlpf.tif
Discontinued product -
available on request only

silicone-free thermal transfer compound
wlk30_120web.jpg
thermally conductive, electrically not conductive
aos3p2_.eps
  • thermal resistance: 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
TOP 3, 23 x 20 x 1 mm, other strengths and versions on request
gs66p_.eps
  • thermal resistance (GS 3): 0.4 K/W
TO 66, 18 x 13,5 mm, customer specific versions on request
25 - 36 (125)Number:

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